The biggest headache in the production of alloy resistors, semiconductor packaging, LED lenses, and PCBs is not excessive glue, but the inability to remove residual glue completely. Blue film, black glue, epoxy resin, UV glue residue, poor welding, resistance drift, assembly scrap, all are real losses of gold and silver.
Manual scraping of damaged substrate?
Is chemical cleaning difficult for environmental protection?
Low efficiency and poor consistency?
Don't worry, the "light" speed foreign aid has arrived!
Why choose CKD laser glue remover?
Non contact processing: Laser only acts on the adhesive layer, without the need for cutting tools or chemical solvents, reducing the risk of damage to substrates such as alloy resistors, chips, PCBs, etc.
Micron level positioning: High resolution CCD vision automatically recognizes the position of the product and matches the glue removal path, suitable for precision glue removal of small-sized, high-density, and irregular structures.
Automation compatibility: It can be integrated with automatic loading and unloading, visual screening, and flipping mechanisms, supporting intelligent recognition of good/defective products and reducing manual dependence.
No chemical solvents: No consumables such as alcohol or cleaning agents are required, no chemical waste is generated, the workshop is cleaner, and meets the requirements of green production.
Typical application scenarios
Semiconductor Packaging: Alloy Mold Plastic Encapsulation Resistance, Electronic Chip Mold Plastic Encapsulation Residual Adhesive Treatment
Alloy resistors/ceramic resistors: Remove black glue, protective glue, and process residue to reduce the risk of resistance drift
LED photoelectric lens: cleaning of residual adhesive in mold sealing to maintain a clean optical surface
SOT252 and other packaged devices: surface and pin adhesive layer removal, compatible with epoxy resin, silicone, UV glue, etc
PCB and precision elect。
Which factories are suitable?
If your production line is facing the following problems
Alloy resistor manufacturing: resistance drift after debonding, difficult to control consistency;
Semiconductor/PCB packaging: Worried about damaging the substrate or solder pads due to adhesive removal, resulting in reduced yield;
Precision electronic assembly: The efficiency of manual scraping is low, and the quality fluctuates greatly with the status of personnel;
Compliance and upgrade requirements: Chemical cleaning has high environmental pressure, or there is an urgent need to connect with automated production lines.
The above pain points are precisely the core application scenarios of laser debonding technology.
Say goodbye to the limitations of traditional methods and reshape the production line standard with non-contact processing - Guangyuesheng laser glue remover, providing you with a more stable and environmentally friendly precision cleaning solution.
